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RFI and EMI - Contacts, Fingerstock and Gaskets

制造商 Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
4186PA51H00100

4186PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

25,435
RFQ
4186PA51H00100

Datasheet

51H Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 1.000" (25.40mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
10117780-001LF

10117780-001LF

RFI FINGERSTOCK CU GOLD SOLDER

Amphenol ICC (FCI)

18,504
RFQ
10117780-001LF

Datasheet

- Tape & Reel (TR) Active Fingerstock - 0.236" (6.00mm) 0.268" (6.80mm) 0.083" (2.10mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
4052AC51H00071

4052AC51H00071

RFI FOF GASKET PU ADH

Laird Technologies EMI

36,218
RFQ
4052AC51H00071

Datasheet

51H Bulk Active Fabric Over Foam D-Shape 0.079" (2.00mm) 0.710" (18.03mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
10121135-001LF

10121135-001LF

RFI FINGERSTOCK CU GOLD SOLDER

Amphenol ICC (FCI)

25,575
RFQ
10121135-001LF

Datasheet

- Tube Obsolete Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.138" (3.50mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
4520PA51G00100

4520PA51G00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

39,222
RFQ

-

51G Bulk Active Fabric Over Foam Square 0.080" (2.03mm) 1.000" (25.40mm) 0.080" (2.03mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
120220-0313

120220-0313

RFI SHD FINGER TITAN CU NICK SLD

ITT Cannon, LLC

19,382
RFQ
120220-0313

Datasheet

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.147" (3.73mm) 0.118" (3.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
67SLA060080070PI00

67SLA060080070PI00

SLA W6XH8XL7MM

Laird Technologies EMI

29,248
RFQ

-

SMD Contact Bulk Obsolete - - - - - - - - - -
120220-0315

120220-0315

RFI SHD FINGER TITAN CU NICK SLD

ITT Cannon, LLC

18,092
RFQ
120220-0315

Datasheet

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.157" (3.99mm) 0.157" (4.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
1-1447360-1

1-1447360-1

RFI SHLD FINGER CU GOLD SOLDER

TE Connectivity AMP Connectors

22,716
RFQ
1-1447360-1

Datasheet

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.039" (1.00mm) 0.138" (3.50mm) 0.055" (1.40mm) Copper Alloy Gold 1.967µin (0.05µm) Solder -
1554825-1

1554825-1

RFI SHLD FINGER CU GOLD SOLDER

TE Connectivity AMP Connectors

19,306
RFQ
1554825-1

Datasheet

- Bag Active Shield Finger, Pre-Loaded - 0.045" (1.15mm) 0.094" (2.40mm) 0.051" (1.30mm) Copper Alloy Gold Flash Solder -
BMI-C-001-SN

BMI-C-001-SN

RFI SHLD FINGER BECU TIN SOLDER

Laird Technologies EMI

18,381
RFQ
BMI-C-001-SN

Datasheet

BMI-C Tape & Reel (TR) Active Shield Finger - 0.079" (2.00mm) 0.122" (3.11mm) 0.096" (2.44mm) Beryllium Copper Tin - Solder -
10103958-001LF

10103958-001LF

RFI FINGERSTOCK CU TIN

Amphenol ICC (FCI)

23,989
RFQ
10103958-001LF

Datasheet

- Tape & Reel (TR) Active Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.132" (3.35mm) Copper Alloy Tin 30.0µin (0.76µm) - -
4912PA51H00100

4912PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

24,801
RFQ

-

51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 1.000" (25.40mm) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
67BCG2504303510R00

67BCG2504303510R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

12,036
RFQ
67BCG2504303510R00

Datasheet

BCG Bulk Active Fingerstock - 0.098" (2.50mm) 0.169" (4.30mm) 0.138" (3.50mm) Beryllium Copper Gold - Solder -
4157PA51H00100

4157PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

35,780
RFQ

-

ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.787" (20.00mm) 1.000" (25.40mm) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
SMG118157R-0.197

SMG118157R-0.197

RFI FILM OVER FOAM PU

Leader Tech Inc.

12,788
RFQ
SMG118157R-0.197

Datasheet

- Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.157" (4.00mm) 0.197" (5.00mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
SMG256197R-0.118

SMG256197R-0.118

RFI FILM OVER FOAM PU

Leader Tech Inc.

36,604
RFQ
SMG256197R-0.118

Datasheet

- Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.197" (5.00mm) 0.256" (6.50mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
67BCG2003201508R00

67BCG2003201508R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

14,652
RFQ
67BCG2003201508R00

Datasheet

BCG Bulk Active Fingerstock - 0.078" (2.00mm) 0.126" (3.20mm) 0.059" (1.50mm) Beryllium Copper Gold - Solder -
10116189-001LF

10116189-001LF

RFI FINGERSTOCK CU GOLD

Amphenol ICC (FCI)

13,451
RFQ
10116189-001LF

Datasheet

- Tape & Reel (TR) Active Fingerstock - - - - Copper Alloy Gold 3.00µin (0.076µm) - -
67B5N4004005108R00

67B5N4004005108R00

SP,CON,TNR 5.10X4.00X4.00MM

Laird Technologies EMI

13,299
RFQ

-

- Cut Tape (CT) Active - - - - - - - - - -
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